International Conference on

Optical and Photonic Engineering

08 - 11 May 2018 Shanghai, China

International Conference on

Optical and Photonic Engineering

08 - 11 May 2018 Shanghai, China

                       

News: Full paper can be upload to SPIE submission system now (click to view), the submission deadline is April 25th, 2018.

Optical and Photonic Engineering(中文首页)

Introduction

Welcome to icOPEN 2018!

Following the success of icOPEN 2016 in Chengdu, OPSS is proud to continue icOPEN 2018 in Shanghai, China.

Organized and hosted by OPSS, and co-organized by  Shanghai University, Xi'an Technological University, Xi'an University of Posts & Telecommunications,Chinese Laser Press and OPSS China Chapter, this event will be held in Shanghai, China during May 08-11, 2018. icOPEN2018 will provide a timely platform to conduct a recap of the latest technologies and industry milestones, and promote optical and photonic engineering to a wider audience

OPSS SDC (Student Design Competition) is set up to provide a platform for the contributing students to show themselves in icOPEN 2018

We look forward to your participation in icOPEN2018!

Publication

icOPEN 2018 conference proceedings will be published by SPIE, which will be included in SPIE Digital Library, provided to the Web of Science Conference Proceedings Citation Index-Science, Scopus, Ei Compendex, and others, to ensure maximum awareness of the Proceedings.



Topics

The primary focus of the conference is on new and original research results in the areas of theoretical findings, design, implementation, and applications. Both theoretical paper and simulation (experimental) results are welcome. Topics of interest include, but are not limited to, the following:

  • High Resolution Optical Metrology
  • Digital Holography and Quantitative Phase Imaging
  • 3D Computer Vision
  • Image Processing and Deep Learning
  • 3D Image Acquisition and Display
  • Non-Destructive Testing and Inspection
  • Photomechanics
  • Laser micro-nano processing and Patterning
  • Diffractive and Freeform Fabrication and Testing
  • Optical component and system simulation
  • Optical functional materials and devices
  • Fiber Optics and sensing technology
  • Biomedical Optics and Imaging
  • Ultrafast Lasers and Applications
  • OptikArt
  • Terahertz Science and Technology
  • Information-rich Metrology

Important Dates

Abstract Submission Deadline

March 15, 2018

Notification Day

March 25, 2018

Early Bird Registration Deadline Day

April 10, 2018

Full Paper Submission Deadline

April 25, 2018

Final Paper Submission Deadline

May 20, 2018


Submission

The submission deadline is March 15, 2018. The submission system has been closed for now. For any question related to the submission, please feel free to contatc secretary@icopen.net


Poster

Please read the Details for the Poster, and click on the following link to download the corresponding session PPT template

Honorary Speakers (More details)

SongLin Zhuang

University of Shanghai for Science and Technology, China

David J. Brady

Duke University, USA

Allard Mosk

Utrecht University, Netherlands

Dinping Tsai

National Taiwan University, Taiwan, China

Yukitoshi Otani

Utsunomiya University, Japan

Okihiro Sugihara

Utsunomiya University, Japan

Sen Han

University of Shanghai for Science and Technology, China

Guohai Situ

Shanghai Institute of Optics and Fine Mechanics, China

Wolfgang Osten

University of Stuttgart, Germany

Christof Pruss

University of Stuttgart, Germany

Toyohiko Yatagai

Utsunomiya University, Japan

Satoshi Hasegawa

Utsunomiya University, Japan

Yaochun Shen

University of Liverpool, UK

Motoharu Fujigaki

University of Fukui, Japan

Guoan Zheng

University of Connecticut, USA

Wen Chen

The Hong Kong Polytechnic University, Hong Kong, China

Beiwen Li

Iowa State University, USA

Sergiy Valyukh

Linkoping University, Sweden

Jingang Zhong

Jinan University, China

Vivi Tornari

The IESL of the FORTH, Greece

Hongxin Luo

Shanghai Synchrotron Radiation Facility, China

Lei Li

Sichuan University, China

Lin Zhou

National University of Defense Technology, China

Jiangtao Xi

University of Wollongong, Australia

Chenxing Wang

Southeast University, China

Bing Pan

Beihang University, China

Feng Gao

University of Huddersfield, UK

Jinsong Leng

Harbin Institute of Technology, China

Xide Li

Tsinghua University, China

Zhengjun Liu

Harbin Institute of Technology, China

Song Zhang

Purdue University, USA

Yajun Wang

Wuhan University, China

Houxiao Wang

Jiangsu University, China

Richard Leach

University of Nottingham, UK

Xinzhu Sang

Beijing University of Posts and Telecommunications, China

Liangcai Cao

Tsinghua University, China

Elke Reinhuber

Nanyang Technological University, Singapore

Jinyou Shao

Xi’an Jiaotong University, China

Jianglei Di

Northwestern Polytechnical University, China

Huadong Zheng

Shanghai University, China

Chao Zuo

Nanjing University of Science and Technology, China

Shufeng Sun

Qingdao University of Technology, China

Qionghua Wang

Sichuan University, China

Wenjing Zhou

Shanghai University, China

Zonghua Zhang

Hebei University of Technology, China

Juan Liu

Beijing Institute of Technology, China

Bin Hu

Beijing Institute of Technology, China

YongKeun Park

Korea Advanced Institute of Science and Technology, Republic of Korea

Mingjun Ren

Shanghai Jiao Tong University, China

Huijie Zhao

Beihang University, China

Hao Yan

Shanghai Jiao Tong University, China

Jiang Fei

Shanghai Academy of Fine Arts, China

Mingxia He

Tianjin University, China

Zhanghua Han

Nanjing University of Science and Technology, China

Xiangchao Zhang

Fudan University, China

Lingbao Kong

Fudan University, China

Jian Wang

Huazhong University of Sciency & Technology, China

Xiaodi Tan

Beijing Insititue of Technology, China

Xiufeng Yang

DeYi Times(Tianjin) Science&Technology Co. LTD, China

Haibo Ge

Xi'an University of Posts & Telecommunications, China

Yanzhou Zhou

Guangdong University of Technology, China

Xiaoyuan He

Southeast University, China

Yu Fu

Nanyang Technological University, Singapore

Co-organized by

Supported by